A group of chip makers and EDA tool vendors have formed a design-for-manufacturing (DFM) coalition intended to build on previous DFM efforts. Blaze DFM will contribute a proposed standard for the interaction between chip design tools and lithography simulation engines.
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Wednesday, September 19, 2007
Tuesday, September 18, 2007
Hot Chips, Cool Books, Brainiacs & Workaholics Abound
Synergy notwithstanding, Dave Reed, Vice President of Marketing & Business Development at Blaze DFM, offered answers by email to the following questions regarding the Cadence/Clear Shape deal.
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Si2 Announces New Design-For-Manufacturability Coalition
Major Technology Contribution Received from Ponte Solutions and Blaze DFM
Silicon Integration Initiative (Si2) today announced the formation of the Design-For-Manufacturability Coalition (DFMC) which will build on previous efforts to ensure that ICs can be manufactured in accordance with the original design. Founding members include Cadence, Freescale Semiconductor, IBM, Ponte Solutions, Samsung, Sagantec, ST Microelectronics, and Texas Instruments.
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Silicon Integration Initiative (Si2) today announced the formation of the Design-For-Manufacturability Coalition (DFMC) which will build on previous efforts to ensure that ICs can be manufactured in accordance with the original design. Founding members include Cadence, Freescale Semiconductor, IBM, Ponte Solutions, Samsung, Sagantec, ST Microelectronics, and Texas Instruments.
More >
Monday, September 17, 2007
Ponte Solutions and Blaze DFM Deliver Yield and Litho Modeling Elements to Si2 Specification, 9/17/07
Ponte Solutions(TM), the bridge between design and manufacturing, and Blaze DFM, the electrical DFM company, today announced delivery of the first modeling elements committed to Si2's Design For Manufacturability Coalition (DFMC) last year. These contributions are the primary drivers for the critical area analysis and lithography elements of Si2's DFMC efforts.
Ponte Solutions(TM), the bridge between design and manufacturing, and Blaze DFM, the electrical DFM company, today announced delivery of the first modeling elements committed to Si2's Design For Manufacturability Coalition (DFMC) last year. These contributions are the primary drivers for the critical area analysis and lithography elements of Si2's DFMC efforts.
Thursday, September 13, 2007
How low can you go? A look at 45-nm-IC-design challenges, EDN 9/13/07
If you have tools for the 65-nm or even the 90-nm node, moving to the 45-nm node requires no retooling. But designers moving to this node must adopt some advanced design techniques and be aware of some new design rules that foundries have imposed to ensure that SOC designs yield acceptable results.
If you have tools for the 65-nm or even the 90-nm node, moving to the 45-nm node requires no retooling. But designers moving to this node must adopt some advanced design techniques and be aware of some new design rules that foundries have imposed to ensure that SOC designs yield acceptable results.
Tuesday, September 4, 2007
Are EDA Companies Getting Fair Value for their Software? EDA Weekly 9/3/07
An interview with Jacob Jacobsson, CEO of Blaze DFM. The company has a product, Blaze MO, which significantly reduces leakage power and thereby improves parametric yield. Near the end of the interview we discussed the issue of whether Blaze and by extension other EDA companies were deriving the appropriate amount of value for the benefits their products and services provide to their customers.
An interview with Jacob Jacobsson, CEO of Blaze DFM. The company has a product, Blaze MO, which significantly reduces leakage power and thereby improves parametric yield. Near the end of the interview we discussed the issue of whether Blaze and by extension other EDA companies were deriving the appropriate amount of value for the benefits their products and services provide to their customers.
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