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Monday, December 3, 2007

Global Semiconductor Alliance Member Spotlight: Blaze DFM

Leakage power has been described as the most critical challenge facing designers of advance chips today. At 90nm, 30% of a chip’s total power consumption may be attributed to leakage. At 65nm, leakage represents over 50% of a chip’s total power consumption and this trend will continue at 45nm and beyond.

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Blaze DFM Signs Agreement with Korean Distributor Daou Xilicon

Blaze and Daou Xilicon Partner to Introduce Electrical DFM Solutions to Korea

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Blaze DFM Beefs Up Field Operations in Japan

Synkom to Provide Technical Support for Blaze's Burgeoning Japanese Customer Base

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Blaze DFM Expands European Field Operations

Accomplished EDA executive to spearhead proliferation of electrical DFM solutions in Europe

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