TSMC Announces Power Trim Service for Advanced Chip Leakage Power Reduction

Exclusively-licensed technology from Blaze DFM, Inc. enables design-specific leakage power reduction offering

Hsin-chu, Taiwan, R.O.C. – April 15, 2008 - Taiwan Semiconductor Manufacturing Company, Ltd.
(TSE: 2330, NYSE: TSM) today announced that it has signed an exclusive agreement with Blaze DFM, Inc. to offer Power Trim Service, a new service offering combining a patented Blaze power optimization technology with special variations of TSMC’s advanced manufacturing process.

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